Jacob Vehonsky's Linkedin Analytics

I am an experienced problem solver and solution finder in the semiconductor packaging industry. I enjoy getting to the bottom of complex issues and can bring an outcome focused mindset to any job role. I have a penchant for pointing out and cleaning up inefficiencies that exist in systems/processes regardless of how long they have been established as the norm. I have taken processes all the way from concept to specialized tool development to HVM transfer and have received Intel’s top award in 2021 for helping to save over $1B in EmIB substrate costs over the next 5 years, specifically stemming from my work around micro bump electroplating which debuted on Intel SPR and will continue for multiple generations. In addition to any technical skill, I bring an ability to explain complex things in simple terms and get the point across quickly. I am also able to use my personability to have effective collaboration that ends up bringing output that is more than the sum of its parts.